AEPONYX is first to invent a new integrated optics platform combining Silicon Photonics in Silicon Nitride with electrostatically actuated planar micro-opto-electro-mechanical-systems. The technology is patented and the subject of several more pending patent applications. Products can be designed to leverage AEPONYX very small and very high performance optical switch chips, which can be combined with integrated optics filters and native packaging for optical fibers and active elements such as lasers and photodetectors. Two products are being developed: 1) an NG-PON2 ONU Transceiver based on a our 1x4 cell for use in next-generation fiber optic access networks and 2) an NxN up to 48x48 Radix matrix optical switch for use in 5G and datacenter infrastructures. AEPONYX has attracted a seed round of C$3M as part of a C$10M investment towards the platform and is now 14 employees. AEPONYX has developed its own process flow compatible with the C2MI & Teledyne Dalsa MEMS foundries as we...
AEPONYX is first to invent a new integrated optics platform combining Silicon Photonics in Silicon Nitride with electrostatically actuated planar micro-opto-electro-mechanical-systems. The technology is patented and the subject of several more pending patent applications. Products can be designed to leverage AEPONYX very small and very high performance optical switch chips, which can be combined with integrated optics filters and native packaging for optical fibers and active elements such as lasers and photodetectors. Two products are being developed: 1) an NG-PON2 ONU Transceiver based on a our 1x4 cell for use in next-generation fiber optic access networks and 2) an NxN up to 48x48 Radix matrix optical switch for use in 5G and datacenter infrastructures. AEPONYX has attracted a seed round of C$3M as part of a C$10M investment towards the platform and is now 14 employees. AEPONYX has developed its own process flow compatible with the C2MI & Teledyne Dalsa MEMS foundries as well as the IBM Packaging Facility at C2MI and at their plant in Bromont. This means that AIM Photonics should also be able to help AEPONYX accelerate the packaging of its chips, namely fiber optic attach as well as hybrid integration of indium phosphide active components such as lasers as well as photodetectors, AEPONYX has also designed its own high-voltage CMOS MEMS control chip. The team at AEPONYX is composed of several micro-fabrication process engineers specialized in MEMS process flow, integrated optics circuit design engineers & packaging engineers which enable us to drive design and microfabrication at C2MI, Teledyne Dalsa, University Fabs and Packaging Facilities such as AIM TAP and C2MI/IBM Bromont.
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Francois Menard
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Francois Menard CTO CTO