NOCONTACT TEST OF PACKAGES Multi Chip Modules or MCM aka MCP. It is widely accepted that the cost of testing can be as high as a third of the total cost of an MCM (the other two-thirds being device and packaging costs), therefore it is important to consider testing carefully while/before making design decisions. While a new design will require more extensive testing than a mature design, MCMs must be designed with good testability in mind. Recent Intel co-EMIB etc. packages are supported widely. Company is incorporated in Kingston Ontario Canada...
NOCONTACT TEST OF PACKAGES Multi Chip Modules or MCM aka MCP. It is widely accepted that the cost of testing can be as high as a third of the total cost of an MCM (the other two-thirds being device and packaging costs), therefore it is important to consider testing carefully while/before making design decisions. While a new design will require more extensive testing than a mature design, MCMs must be designed with good testability in mind. Recent Intel co-EMIB etc. packages are supported widely. Company is incorporated in Kingston Ontario Canada
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Jan Hoppe
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Jan Hoppe CEO Acting Chief Executive Officer Radiation Electronics Ltd. with a long record of working in the semiconductors industry. Applied R&D.